Tech sovereignty has become a looming priority for a number of nations these days, and now a startup working in semiconductors has received a major boost in aid of that effort for Germany and Europe.
Black Semiconductor, which is developing a new kind of chip-connecting technology based on graphene, has raised €254.4 million (around $273 million at today’s rates), in a combination of private and public money funding.
The sum is one of the largest to date raised by a European startup working in semiconductors. Black is a spin-out from the University of Aachen co-founded by brothers Daniel and Sebastian Schall (respectively the CEO and CFO).
Daniel Schall said in an interview that the plan is to use the funding to continue its R&D efforts, to build out a “pilot” production facility in Aachen, hire more engineers and other staff from around the world, and to hone the earliest stages of its business development, which will involve working directly with major chip manufacturers across the rest of Europe, such as ASML in The Netherlands, to ramp up production in volume; but also the cloud computing and other “hyperscaler” technology companies that are some of the biggest buyers of chips. Schall said that if all goes to plan, the startup expects to be producing its first commercial products in seven years, by 2031.
The funding, a Series A, is important not just for its size but also because of the intention behind it.
A full €228.7 million of the sum is coming from Germany’s federal government and North-Rhine-Westphalia, a combination of equity and funding based on the “Important Project of Common European Interest” provision, an €8.1 billion piece of state aid that the European Commission carved out in 2023 specifically for big technology swings like this one.
“Sovereignty in Europe is a big topic, and we have a technology that puts us ahead of the curve,” Daniel said in an interview. “What we do is brand new, we’re not running after somebody. We have an opportunity to do something very new here, brand new here. And that’s really exciting.”
The remaining €25.7 million is coming in the form of a more classic equity round. Porsche Ventures and Project A Ventures are co-leads, with participation from Scania Growth, Capnamic, Tech Vision Fonds, and NRW.BANK. Vsquared Ventures, Cambium Capital, and Onsight Ventures, the fund started by Hermann Hauser, the co-founder of ARM, had previously backed Black with around $6.6 million of seed funding in 2020, and they are in this more recent round as well.
Schall said his interest in understanding why electronics works the way they do extends back to his childhood when he first started to pull radios apart to understand how they worked. That led to an interest in the transistors in the radios, and by the time he was in university, much deeper interest in semiconductors.
At Aachen, working with graphene, the atom-thick carbon allotrope, he and his team came up with a concept of using the material for photonics to connect chips.
His logic for focusing on chip connectivity, he said, was not just because there are already many companies building excellent and always-improving chips (an area presently dominated by Nvidia and its GPUs) but also because the connectivity part has not been definitively solved, especially in situations where hundreds or thousands of chips might be working together. With most of the chip connectivity efforts these days focused on silicon-based photonics, and the wider ecosystem for semiconductors extending typically to more than 100 providers, Schall said, he saw an opportunity to break completely new ground by commercializing his research.
“The problem is efficiency. In the end that’s the main problem: efficiency in computation,” he said.
Given the costs of operating data centers for cloud computing providers, offering technology that could help reduce those costs becomes potentially important not just for improving margins but also scaling to meeting data usage needs, one reason why Black is actively speaking with potential customers in the ecosystem, to understand their needs and secure interest, even before the technology is being shipped.
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